Slide 9
Slide 9 text
2016 test chip
● Note: all subject to change. Comments and advice welcome
● Tape out by the end of 2016
● 3mm x 3mm 28nm die, wire-bond BGA package
● 4 cores (evaluating BOOM), each with 32KiB I+D$
– BERI PIC, tagged memory, >1GHz, run-control+trace debug,
RV64G+C
● 512KiB shared L2
● 128KiB tag cache
● LPDDR3 memory controller+PHY, 32-bit wide
● 8 Minion cores (PULP-based) with shim. 500MHz+. Provide SDHC,
SPI, I2C, I2S, UART
● USB 2.0 host PHY and controller
● High-speed I/O to FPGA (tbd, input very welcome)