Slide 9
Slide 9 text
Smaller electronic
packages
• Hand mounting: TO-92, TO-220
• Hand mounting ICs: SIP, DIP
• Surface mounting: SOIC, BGA, PGA
• Higher density: the same or even more energy
per system, ironically
• More heat for each module
Kenji Rikitake / oueees 201506 part 1 9-JUN-2015 9