POST CES INTEL 2017

A short presentation I did at Gearbox, ihub with a focus on the technologies Intel Corporation showcased during the Consumer Electronics Show 2017. The slides with frozen black images are actually videos .The following are links for the videos that were used in the presentation:
slide 7 : http://www.tomshardware.com/news/intel-project-alloy-vr-hmd,32494.html
slide 9 : https://youtu.be/kwqkbWFNIhU
slide 12 : http://blogs.intel.com/technology/2016/02/paving-the-road-to-5g-mobile-services/

Enjoy!!

Transcript

1. Intel Confidential — Do Not Forward POST CES 2017 INTEL PERSPECTIVE Alfred Ongere Intel Student Partner MMU
2. Overview  Intel virtual booth tour  Project Alloy  5G Modems  Intel Compute Card 2
3. Intel Virtual booth Tour 360 degrees Virtual experience http://www.intel.com/content/www/us/en/events /intel-ces.html 3
4. Project alloy 4 • Open source HMD(Head Mounted Display) • Accessible to developers Late mid 2017 • Immersive experience - merged reality
6. 6 • No external sensors RealSense Cameras • Untethered – no dangling wires
8. Intel compute card • 95mm by 55mm by 5mm • What's inside: CPU, GPU, RAM, storage and even wireless connectivity. • USB,HDMI ports • Will run Windows and Linux • Flexibility in switching • Official rollout in mid 2017 • Partners already on board Dell, HP and Lenovo • Maintenance - easy swap 8
9. Intel’s 5G Modem 9
11. • Delivers in sub 6GHZ and mmWave spectrum 11
12. Intel 5G Mobile Test Platform 12