Technical Overview (ThermieL Co., Ltd.)

Transcript

1. CEO / fujita@thermiel.com Ryohei Fujita Nagoya University Certified Venture company Technical Overview of ThermieL's Measurement Technology ThermieL Co., Ltd., JAPAN 2026.03.06 https://www.thermiel.com/en https://www.thermiel.com/en
2. ThermieL, Co., Ltd. 2 Name ThermieL Co., Ltd. * Certified as a venture company from Nagoya University Establishment June 10, 2025 Co-Founders CEO Ryohei Fujita CTO Hosei Nagano COO Shogo Okishio Business Description 1. Development, manufacturing, sales, and maintenance of measuring instruments and related parts 2. Contract measurement and analysis of material properties 3. Holding lectures, symposiums, seminars, etc. 4. All operations incidental to or related to the preceding items Ryohei Fujita CEO Hosei Nagano CTO Shogo Okishio COO Corporate website Company profile
3. ThermieL, Co., Ltd. ～50 ～100 ～200 ～500 ～800 Background Wide bandgap Power Semiconductor （SiC/GaN） Low power loss High operating temperature (200°C ~) High-speed switching Data Center 5G Base Stations High-speed rail EV eVTOL Heat flux (W・cm-2) （SiC/GaN） Power Semiconductor（Si） Nuclear fuel rod surface Hot Plate Applications of power semiconductors Thermal management has become an essential requirement. Rocket engine Nozzle surface
4. ThermieL, Co., Ltd. 4 Challenges in heat dissipation design (R&D, Mass production) Development speed is slowed down due to the rework of thermal design. Water and air cooling Heat Conduction Sealing Materials Circuit board Semiconductor chips Heat dissipation substrate Thermal resistance of the contact part Unpredictable Anisotropy and heterogeneity Cracking Stacking Mass production Forming Redesign (3 months ~ half a year [2]) Final product (Semiconductor Module) Heat Dissipation Materials (Ceramics, resins) Tesla Model 3 Inverter [1] [1] https://www.pgcconsultancy.com/post/examining-tesla-s-75-sic-reduction [2] DENSO TECHNICAL REVIEW Vol.24 2019 Power Semiconductor Module
5. ThermieL, Co., Ltd. 5 Challenges in heat dissipation design (R&D) Filler Volume fraction 銅 Metallize substrate TIM Thermal Interface Material Heat Sink Heat dissipation structure Improving the thermal conductivity of the composite material itself. Copper AlN Contact interface Fujita, The 45th Heat Transfer Symposium Reduction of contact and interfacial thermal resistance Contact and interface thermal resistance and thermal conductivity evaluation as composites are required. Decreased flexibility, Thermal conductance Trade-offs Power Semiconductor Module Heat spreader
6. ThermieL, Co., Ltd. 6 Laser Periodic Heating method using Lock-In Thermography Sample Laser Cycle heating Thermal Properties Mapping Thermophysical properties measurement by regression analysis 𝒇 Φ 𝝓 A Infrared camera Equivalent to the number of detection elements 𝑻(𝒙, 𝒚, 𝒕) Laser Heating signal Temp. response Digital lock-in processing Noise Amplitude Phase delay Outline of the measurement system Reproduction of boundary conditions by measurement environment and precision optics, derivation of theoretical models, After satisfying all the factors such as high-speed data analysis technology and pre-processing for each material, it is proposed as a measurement method.
7. ThermieL, Co., Ltd. 7 Typical applications Φ25µm Interfacial thermal resistance 2-D Interface thermal resistance Microscale Materials Laser beam Sample LIT IRT Laser Sample IRT Sample Laser IRT Sample Laser 360° In-plane direction Thermal diffusivity Thickness direction Thermal conductivity e.g. AlN, SiN Ceramics, Isotropic graphite, CFRP, Advanced thermal material e.g. Isotropic graphite, CFRP, Advanced thermal material e.g. Carbon fiber, Cu fiber, Ni fiber, AlN whisker e.g. AlN/Cu (DBC), SiN/Cu (DBC), Graphite/Graphite(Adhesive), Cu/Mo (SPS) e.g. Cu/TIM/Si, Cu/TIM/Cu, Graphite/Graphite(Adhesive) Infrared Thermography (λ=2-5μm) LASER Periodic heating Bilayer material 2-D We have developed measurement methods that meet each requirement using the LIT method and apply them to a wide variety of materials. 銅 Heat dissipation structure Copper Insulating Ceramics TIM Heat Sink
8. ThermieL Co., Ltd. 8 Business Objectives Final product (Semiconductor Module) Laser Periodic Heating method using Lock-In Thermography Infrared Thermography Cycle heating Laser light Reduce Redesign risk Sample Signal source Thermal properties Mapping Thermal resistance of the contact part Unpredictable Anisotropy and heterogeneity Cracking When stacking Mass production When forming Redesign (3 months ~ half a year [2]) Heat Dissipation Materials (Ceramics, resins) Thermospect
9. ThermieL, Co., Ltd. 9 Development status Thermophysical analyzer "Thermospect" Concept model has been developed. We are developing proprietary software that can complete one-stop measurement analysis
10. ThermieL, Co., Ltd. 10 External evaluation × 「Forbes JAPAN ACADEMIA ENTREPRENEUR SUMMIT 2023」 Business Contest Grand Prix [University Frontiers] Research Results for Fostering Startups (Yomiuri Shimbun article)
11. Ryohei FUJITA fujita@thermiel.com Hosei Nagano nagano@thermiel.com For inquiries, please contact the following email address. 11 Certified as a venture company by Nagoya University