DFB Laser Chip Defect Detection Based on Successive Subspace Learning
2020 10th Annual Computing and Communication Workshop and Conference (CCWC)
Date of Conference: 06-08 January 2020
Conference Location: Las Vegas, NV, USA
Learning Tuo Liu, Xiaobin Zhang, Yuxi Wang, Yen-Ting Pan Yuanjie Semiconductor Technology Dennis Hou, Rutgers University Janpu Hou, Applied Data Research January 6, 2020
(DFB) laser chip manufacturer and laser module assembly house, there is a need of reliable tool for quality engineers to carry out the acceptance sampling plan. There are variations of DFB lasers with different wavelength, power, threshold, operating temperature requirement etc. To make acceptance sampling reliable for semiconductor laser chip producer who need to control the specificity and for laser module assembly factories who need to control the sensitivity, a classifier with on-device training capability is needed. In this paper, an embedded automated distributed feedback (DFB) lasers chip defect classifier based on successive subspace learning (SSL) is developed for such application to classify active, surface, edge and coating defects generated by manufacturing processes. The designed classifier was verified with accuracy=97.43%, precision=96.80%, sensitivity=91.32%, specificity=97.66% and F1 score=0.968. Abstract
Subspace Learning applied to automatic optical inspection of laser chips Simple Hardware • Implemented and tested on Low cost ARM platform Easy to Use • Point and click