Vaigunthan Puvanenthiram

SSIs-2023 Interview Deck

Transcript

1. BSc of Engineering - 2020 (Specialized in Electronic and Telecommunication Engineering) University of Moratuwa – Sri Lanka Vaigunthan Puvanenthiram Research and Development Engineer (Mar 2020 - present) ▪ Metrology and Inspection Equipment for Advanced Packaging. ▪ Research : Technologies to measure sidewall roughness of TSV and trenches. ▪ Optical Measurement Technologies 04 March 2023 1
2. 04 March 2023 2 Skills and Experience ▪ Industrial Work : Developing technology for the Roughness measurement of TSV(Through Silicon Vias) and Trenches. ▪ Challenges : Conventional measurement systems can not be used to measure the roughness in high slanted (Aspect ratio > 1: 10) and narrow opening diameter in the order of 1 um or less. Cross-sectional photo image of TSV filling with conductive paste. Source Trenches in the fabrication of micro actuators. Source Contribution : • Involved in identifying suitable technologies readily available to solve this specific metrology challenge and understood the fabrication process, requirement through literature survey and via exchange of ideas with industrial experts. • Worked on proposing a hybrid non contact measurement system combining different optical measurement technologies.
3. 04 March 2023 3 Major Trend in SSI ▪ Silicon Photonics ▪ Heterogeneous Integration (HI) Source : https://ase.aseglobal.com/en/heterogeneous_integration ▪ Reduce the distance between optics and switch provide key advantages in terms of reduced power dissipation, high port density and better bandwidth. ▪ Applications include the high-performance chips for data center, AR/VR industry, automotive industries. Sources : https://sicoya.com/silicon-photonics/
4. 04 March 2023 4 Field of Interest and Future Plans Manufacturing Methods and Characterization Techniques for Smart Systems Research Domain : ▪ Improve the yield in Heterogeneous Integration through a holistic approach which define the measurement, characterization and validation process during fabrication and packaging process during the design stage. ➢ Continue research on the field with strong collaboration with Industry. ➢ Bring in techniques to achieve Sustainability in fabrication process through improved yield, reduced process validation and testing steps.
5. 04 March 2023 5 Thank You