CHIPS R&D and NSTC

NIST at Feb 2023 NACIE meeting

Transcript

1. National Institute of Standards and Technology | U.S. Department of Commerce 1 Update on Research and Development and the NSTC Laurie Locascio Under Secretary of Commerce for Standards and Technology Director of the National Institute of Standards and Technology
2. National Institute of Standards and Technology | U.S. Department of Commerce 2 R&D Updates • Industrial Advisory Committee Meeting: February 7, 2023 (virtual) • Potential recommendations expected from working groups • Working groups: R&D Gaps, Partnerships, Workforce • NSTC White Paper expected in Q1 2023 • NAPMP vision and strategy outline; details to come • Manufacturing USA RFI closed December 12, 2022 • Summary of RFI is being finalized; will inform topic selection • NIST metrology program progressing; planning around grand challenges • Interagency coordination framework under active development
3. National Institute of Standards and Technology | U.S. Department of Commerce 3 CHIPS for America R&D National Semiconductor Technology Center National Advanced Packaging Manufacturing Program Manufacturing USA institutes (up to three) Metrology R&D (NIST) • Strengthen and advance U.S. leadership in R&D • An integrated ecosystem that drives innovation • In partnership with industry, academia, government, and allies • A strategic view of R&D infrastructure, participant value-proposition, and technology focus areas • Informed by the Industrial Advisory Committee
4. National Institute of Standards and Technology | U.S. Department of Commerce 4 National Semiconductor Technology Center Will serve as the focal point for research and engineering throughout the semiconductor ecosystem, advancing and enabling disruptive innovation to provide U.S. leadership in the industries of the future.
5. National Institute of Standards and Technology | U.S. Department of Commerce 5 National Semiconductor Technology Center Elements • Core of centrally operated, in-house research, engineering, and program capabilities combined with a network of directly funded and affiliated entities • Includes applied research, prototyping of devices and processes in a real-world environment, challenges related to scaling, start-up company support, or development of advanced manufacturing tools and processes • Focus research and engineering on challenging projects with a time horizon beyond 5 years • The NSTC will serve as a key convening body for the ecosystem Process • NSTC white paper, 1st quarter 2023 • Summarize the results of a landscape analysis, outline a governance structure, and describe a preliminary operating and financial model
6. National Institute of Standards and Technology | U.S. Department of Commerce 6 National Semiconductor Technology Center – IAC Recommendations
7. National Institute of Standards and Technology | U.S. Department of Commerce 7 National Institute of Standards and Technology | U.S. Department of Commerce 7 National Advanced Packaging Manufacturing Program • To strengthen semiconductor advanced test, assembly, and packaging capability in the domestic ecosystem • Leverage public-private partnerships, including the NSTC and Manufacturing USA • Technologies could include: • Heterogeneous integration • Wafer and panel-based approaches • Tooling and automation • Substrate technology
8. National Institute of Standards and Technology | U.S. Department of Commerce 8 National Institute of Standards and Technology | U.S. Department of Commerce 8 Create an R&D environment advancing the state-of-the art in advanced packaging. Technology innovation Investments to bolster the growth in domestic capacity and enhance capabilities for competitive edge. Ecosystem support NAPMP Target Areas Co-design and simulation Chiplets Pilot packaging facilities Tooling and automation Materials and substrates
9. National Institute of Standards and Technology | U.S. Department of Commerce 9 National Institute of Standards and Technology | U.S. Department of Commerce 9 NIST Metrology R&D • Measurement science for new materials and packaging​ • Physical metrology for next-generation microelectronics • Computation and data​ • Virtualization and automation​ • Reference materials and data, and calibrations​ • Standards for processes, cybersecurity, and test methods
10. Manufacturing USA Institute Network Flexible Hybrid Electronics Integrated Photonics Wide Bandgap Semiconductors Smart Manufacturing Sustainable Manufacturing Modular Chemical Process Intensification Advanced Fibers & Textiles Lightweight Materials Advanced Composites Cybersecurity Manufacturing Digital Manufacturing 3D Printing Robotics Regenerative Manufacturing Biopharmaceutical Manufacturing Bioindustrial Manufacturing San Jose, CA Albany, NY Rochester, NY Raleigh, NC Los Angeles, CA Rochester, NY New York, NY Cambridge, MA Detroit, MI Knoxville, TN San Antonio, TX Chicago, IL Youngstown, OH Pittsburgh, PA Manchester, NH Newark, DE St. Paul, MN Industry Educational Institutions Government Nonprofit
11. Purpose: inform design of up to three Manufacturing USA semiconductor institutes authorized by CHIPS Act Three public webinars held with 463 registered participants 93 comments received* Internal analysis of responses available in late Jan Public comment period Oct. 13 – Dec. 12, 2022 Public report to be submitted for clearance early March *all comments received are publicly posted at https://www.regulations.gov/docket/NIST-2022-0002/comments 61% 7% 4% 28% RFI Responders 1 2 3 4 RFI for Manufacturing USA Semiconductor Institutes
12. National Institute of Standards and Technology | U.S. Department of Commerce 12 Interagency Coordination National Science Foundation Department of Defense Department of Energy Office of Science and Technology Policy Department of Commerce Unified messaging on agency roles and responsibilities​ Program coordination across agencies IP and unique capability access across agencies​ Fluid partnering with other agencies​ Fluid partnering with federally funded institutions​ GOALS
13. National Institute of Standards and Technology | U.S. Department of Commerce 13 Use Case
14. National Institute of Standards and Technology | U.S. Department of Commerce 14 Hypothetical scenario National Semiconductor Technology Center Large auto manufacturer to build sensor for autonomous driving adding chiplets to existing 3D platform from DOD Commons U.S. Foundry Solution fabricated DOD Commons Proven 3D platform NAPMP Access to processes Advanced packaging NAPMP Unique technology Chiplet library Commercial sector Technology reaches marketplace, inspires new technology planning Defense programs Technology evaluated as possible solution for warfighter Disclaimer: Hypothetical capabilities and functions of programs are included only to show the potential benefits of shared resources. Actual capabilities and functions of programs TBD. Automotive company Technology developer
15. National Institute of Standards and Technology | U.S. Department of Commerce 15 Resources for You • Sign up at CHIPS.gov for briefings and other program updates • Contact for external stakeholders: askchips@chips.gov